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Fine Pitch Solution

Current industry dies and pad sizes coming smaller and smaller, more durable and precise probe cards come into subsequence. SSTS® technology had developed an enhanced cantilever probe card technology to meet the fine pitch requirements

SSTS® technologies provide optional material probe for fine pitch applications, it reduces scrub length and increase the touchdowns dramatically 

Bond Pad Pitch:  30m in-line,

 30x60m 2 row stagger,

 40x80m 3 or 4 row stagger, 

Bond Pad Size:    40x40m pad size.

Bond Pad Material: Aluminum, Gold, C4 etc

Probe Wire Diameter: 2.5mil-5mil

Overdrive: 2mils

Probing Temperature (): -40 to 185