Order form
SSTS Suzhou Silicon Test SystemCo.,Ltd Sales Person:
釦巒憐旋慎霞編狼由嗤濤望    
Date:
                     PROBE CARD ORDER FORM       SSTS Rev01 20100403 

CUSTOMER INFORMATION
Customer Name: Quote Ref. Number:
Purchase Order: No. of Probe Cards:
    Req Delivery Date:

DEVICE INFORMATION
Order Type: Exact Reorder Rebuild Repair Change Order
If New Order, Does Customer Requires Design Approval: Yse No ASSEMBLY:
Device Name or ID:   Serial No.: Yse No 
Card Type: Logic Logic Memory LCD Pannel LCD Driver IC
Probe Layout:

Standard (>60u Pitch) Shelf

Micro Fine Pitch (< 60u Pitch In-line or <35x70 Staggered Pitch)

Straight angle(from Prob tip to solder area)

Decentralized angle(from Probe tip to solder area)

Documentation Supplied:

Electronic Coordinate/ File Name:

Bill of Materials/File Name

Reference Card

Wafer
Die Size: X mils microns
Number of Pads/Die:

If multi-DUT, but list does NOT include all DUT's:

Provide Step Size: mils microns

X: Y:

Number of Standard Probes/Die:
Number of RF Probes/Die:
Number of DUT's:
Pad Material: Al Gold Other: Multi-DUT Layout: In-line Diagonal
Pad Shape: Flat Bump Other: Area Array: X

Smallest Pad Size (Passivation Opening):

X mils microns

Wafer Orientation:

Best Fit (SSTS Determines)

Wafer Flat (operator facing Prober)

3:00 6:00 9:00 12:00

Smallest Pad Pitch: mils microns

X In-line

X Staggered


APPLICATION INFORMATION
Tester Model:

Special Probes: G-Probe        MHz

         Matched Impedance  Ohm

         Differential Pair     Ohm

         Other:

Interface/Tower: Standard OEM

          Other:

Prober Model:

Indicate Pads:

         

Temperature: C (0 to 85C - Std Epoxy; 86 to 160C - High Temperature Epoxy)
Black Epoxy (optional for <85C): Yse No

Probe Material: Tungsten

         Rhenium-Tungsten

         Be-Bu

         Palliney 7

         NewTek

Wire Diameter: Best Fit (optimum Build)

         Other: mils

                microns

Tip Diameter: Best Fit (optimum Build)

        Other: mils

               microns

Tip Length: Best Fit (optimum Build)

       Other: mils

              microns

Probe Angle
Epoxy Cleanrence mils microns

Cres: Ohm Path tolerance

Alignment:

Glass Mask +/- 0.5 mils (Standard)

Other: +/- mils

Other: +/- microns

Since pad length <66u, 'Pad Scrub Center' option is suggested

Scrub Thru Center (Standard)

Scrub Starting at Center

Other:

Probe Force: 1.5 g/mil (Standard)

         Other: g/mil

         Other:

Measurement: Std 20% 100%

Planarity: +/- 0.5 mils (Standard)

        Other: +/- mils

        Other: +/- microns

Edge Sensor:

Not required 2- wire

2- wire isolated 3- wire isolated

Location:

Scripe Active Pad

Other:

Settings:

Scripe On (+/- 0.2 mil of 1st touch)

Off (+/- 0.2 mil last of touch)

Other:

Tip Depth: mils (PCB bottom to wafer)

       microns(PCB bottom to wafer)

Leakage

Prober Over Drive: mils

PCA Test: Yse No OD: mils

       Hard Report Soft Report

Due to how the PCA verifies scrub, using the same PCA OD as Prober OD will not center scrub on pad. To center scrub on pad, it's recommended to use a reduced PCA OD. If not sure of appropriate OD, please inquire.


PRINTED CIRCUIT BOARD INFORMATION

Printed Circuit Board:

SSTS Supplied Customer Supplied

Model, P/N, or Description:

Ring Open mils microns

Aperture: mils microns

Mounting Ring/ Stiffener:

Not required

Customer Supplied

SSTS Supplied

Model, P/N, or Description:

Die Pad to Printed Circuit Board Trace: Best Fit (SSTS Selects) Customer Supplied

                     Bonding Diagram    Other:

Components: Not required

        SSTS Supplied

        Customer Supplied/SSTS Installed

        Customer Installed

          Not required

          Per Attached File

Component Value Qty Location

Note: include separate sheet/file for large quantities

Wiring/Jumpers:

As indicated in adjacent chart

Per Attached File

As indicated in adjacent chart

Notes:

Wire Size Trace-to-Trace   Cut Trace #
 
 
 
   
 

Note: include separate sheet/file for large quantities

Printed Circuit Board Vs. DUT Orientation:

1) Select Die Pad #1 location on Diagram ("Check Box")

2) Specify a Key Pin or Channel on PCB:

3) Specify Key Pin location on PCB (question #2),

          by choosing A-H from Diagram:

Other:

         
   
     
   
         

SPECIAL INSTRUCTIONS/ NOTES